| Model | – HBJC150I225-Q670B – HBJC150I225-H610B
 | 
| MB Model | – MI225Q6700 – MI225H6100
 | 
| CPU/Chipset | – Intel® 12th/13th LGA1700 Socket Core i7/i5/i3/Pentium/Celeron Processor (Max. 65W TDPs under 180A) – Intel® Q670E Express Chipset
 | 
| BIOS | – AMI Flash ROM | 
| Memory | – 2* Dual CH non-ECC DDR5 4800MHz SDRAM SO-DIMM up to 64GB | 
| Network | – HBJC150I225-Q670: 1* Intel® i219-LM GbE + 1* Intel® i225-V 2.5GbE – HBJC150I225-H610: 1* Intel® i219-V GbE + 1* Intel® i225-V 2.5GbE
 | 
| Graphics | – Intel® UHD Graphics, shared memory – 1* DP 1.4a (Max Resolution: 4096×2304@60Hz)
 – 1* HDMI 2.0b (Max Resolution: 4096×2160@60Hz)
 – 1* VGA (Max Resolution: 1920×1080@60Hz)
 | 
| Storage | – 2* SATAIII (6 Gb/s) 2.5” Device , support RAID 0, 1 – 1* M.2 M-Key (2280, PCIe Gen.3 x4 interface) support NVMe
 – 1* M.2 M-Key (2242, PCIe Gen.4 x4/SATA interface) support NVMe (HBJC150I225-Q670 only)
 | 
| Expansion | – 1* M.2 E-Key (2230, USB2.0/PCIe Gen.3 x1 interface) support CNVi – 1* M.2 B-key (3042, PCIe Gen.3 x1/USB3.2 Gen.2/USB2.0 interface) (HBJC150I225-Q670 only)
 – 1* M.2 B-key (3042, PCIe Gen.3 x1 interface) (HBJC150I225-H610 only)
 – 1* PCIe Gen.4 x16
 | 
| Rear Panel I/O | – 2* RJ45 – 6* USB3.2(Gen.2) (HBJC150I225-Q670)
 – 4* USB3.2(Gen.2) + 2* USB2.0 (HBJC150I225-H610)
 – 1* HDMI
 – 1* DP
 – 1* VGA
 – 2* COM
 – 1* Audio (Line-in, Line-out, MIC)
 | 
| Front Panel I/O | – 1* Power button, 1* Reset button – 2* USB2.0
 – 1* Power LED, 1* HDD LED
 | 
| Internal Connector | – SIM Card slot – 1* GPIO (8 bit)
 – TPM2.0 (optional)
 | 
| Power Source | – 1U FLEX 300W ATX PWR (4+24 pin) | 
| Compliance | – CE, FCC, LVD, RoHS, ErP Ready | 
| Dimensions | – Operating Temperature: 0 ~ 50° C – Storage Temperature: -40 ~ 85° C
 – Humidity: 10% ~ 95% RH @40°C (non-condensing)
 | 
| Temperature | – Operating Temperature: 0 ~ 50° C – Storage Temperature: -40 ~ 85° C
 – Humidity: 10%~95% @40° C (non-condensing)
 | 
| OS Support | – Windows 11, Linux |